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everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ever light.com rev. 1.0 page: 1 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen technical data sheet high power led ? 1w ehp-a08l/ut01-p01/4670 features z feature of the device: small package with high efficiency z color coordinates: x=0.33, y=0.33 according to cie 1931 z typical color temperature: 5600 k. z view angle: 130. z high light flux output: more than 40lm @ 350ma. z esd protection. z soldering methods: hot bar soldering. z grouping parameter: total luminous flux, color coordinates. z optical efficiency: 32 lm/w. z thermal resistance (junction to lead): 15 k/w. z the product itself will remain within rohs compliant version. applications z tft lcd display backlight z decorative and entertainment illumination z signal and symbol luminaries for orientation marker lights (e.g. steps, exit ways, etc.) z exterior and interior automotive illumination materials items description housing black body heat resistant polymer encapsulating resin silicone resin lens heat resistant clear polymer electrodes ag plating copper alloy die attach silver paste chip ingan
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 2 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 dimensions notes: 1. dimensions are in millimeters 2. tolerances unless dimensions 0.25mm
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 3 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 maximum ratings (t ambient =25oc ) parameter symbol rating unit operating temperature t opr -40 ~ +100 oc storage temperature t stg -40 ~ +100 oc junction temperature t j 125 oc forward current i f 500 ma power dissipation p d 2.0 w junction to heat-sink thermal resistance r th 15 k/w electro-optical characteristics ( t ambient =25oc ) parameter bin symbol min typ. max unit condition j4 39 ---- 45 luminous flux (1) j5 v 45 ---- 52 lm viewing angle (2) ---- 2 1/2 ---- 130 ---- deg t11 3.35 ---- 3.55 t12 3.55 ---- 3.75 forward voltage (3) t21 v f 3.75 ---- 3.95 v i f =350ma note. 1. luminous flux measurement tolerance : 10% 2. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 3. forward voltage measurement tolerance : 0.1v
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 4 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 color binning rank b4-1 rank b4-2 x 0.304 0.317 0.318 0.307 x 0.317 0.330 0.330 0.318 y 0.330 0.345 0.327 0.315 y 0.345 0.360 0.339 0.327 reference cct: 6200k-7000k reference cct: 6200k-7000k rank b6-1 rank b6-2 x 0.307 0.318 0.320 0.311 x 0.318 0.330 0.330 0.320 y 0.315 0.327 0.306 0.294 y 0.327 0.339 0.318 0.306 reference cct: 5600k-7000k reference cct: 5600k-7000k rank c0-1 rank c0-2 x 0.330 0.345 0.344 0.330 x 0.345 0.361 0.359 0.344 y 0.360 0.372 0.353 0.339 y 0.372 0.385 0.368 0.353 reference cct: 4600k-5600k reference cct: 4600k-5600k rank c0-3 rank c0-4 x 0.330 0.344 0.343 0.330 x 0.344 0.359 0.356 0.343 y 0.339 0.353 0.334 0.318 y 0.353 0.368 0.351 0.334 reference cct: 4600k-5600k reference cct: 4600k-5600k 0.2 0.22 0.24 0.26 0.28 0.3 0.32 0.34 0.36 0.38 0.4 0.25 0.27 0.29 0.31 0.33 0.35 0.37 cie-x ci e -y b4-1 b6-1 b4-2 b6-2 c0-1 c0-2 c0-3 c0-4 note. 1. color coordinates measurement allowance : 0.01 2. cct value is only for reference. color binning structure graphic representation
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 5 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 typical electro-optical characteristics curves relative spectral distribution, i f =350ma, t ambient =25oc forward voltage vs forward current, t a mbient =25oc relative luminous intensity vs forward current, t a mbient =25oc 0 20406080100 100 150 200 250 300 350 400 forward current (ma) ambient temperature ( c ) forward current derating curve, deratin g based on t jmax =125 c 400 450 500 550 600 650 700 750 800 0 25 50 75 100 relative luminous intensity (% ) wavelength (nm)
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 6 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 typical representative spatial radiation pattern
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 7 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: ranks hue: peak wavelength ref: reference lot no: lot number made in taiwan: production place tube packing specifications 1. tube
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 8 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 2. inner carton 3. outside carton z packing quanity 1. 60 pcs / per tube 2. 20 tubes / inner carton 3. 12 inner cartons / outside carton
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 9 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 reliability test items and results stress test stress condition stress duration solderability tsol=230 , 5sec 1 times resistance to solder heat tsol=260 , 10sec, 6min 3 times thermal shock h 110 20min. ' 10sec. 'l 40 20min. 500 cycles temperature cycle h 100 30min. ' 5min. 'l 40 30min. 1000 cycles high temperature/humidity reverse bias ta=85 , rh=85% 1000hours high temperature/humidity operation ta=85 , rh=60%, if=225ma 1000hours high temperature storage ta=110 1000hours low temperature storage ta=-40 1000hours intermittent operational life ta=25 , if=1000ma 30ms on/ 2500ms off 1000hours high temperature operation life #1 ta=55 , if=350ma 1000hours high temperature operation life #2 ta=85 , if=225ma 1000hours high temperature operation life #3 ta=100 , if=150ma 1000hours low temperature operation life ta=-40 , if=350ma 1000hours power temperature cycle h 85 15min. ' 5min. 'l 40 15min. if=225ma,2min on/off 1000cycles esd human body model 2000v, interval:0.5sec 3 times esd machine model 200v, interval:0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 50% *vf: forward voltage difference 20%
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 10 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 precautions for use 1. over-current-proof though ehp-a08 has conducted esd protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. storage i. do not open moisture proof bag before the products are ready to use. ii. before opening the package, the leds should be kept at 30 or less and 90%rh or less. iii. the leds should be used within a year. iv. after opening the package, the leds should be kept at 30 or less and 70%rh or less. v. the leds should be used within 168 hours (7 days) after opening the package. vi. if the moisture absorbent material (silicone gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. vii. pre-curing treatment : 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-a08 series led package should be mounted on a metal core printed circuit board (mcpcb) with proper thermal connection to dissipate approximately 1w of thermal energy under 350ma operation. ii. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on aluminum with thermal conductive adhesive, etc. iii. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and led lifetime will decrease critically.
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 11 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 4. assembly process flow handling indications do not handle the ehp-a08 by the lens at any time during the assembly process. this can cause damage to the optical surfaces or may dislocate the lens if excessive force is applied. 5. soldering iron i. for prototype builds or small series production runs it is possible to place and solder the led by hand. ii. dispensing thermal conductive glue or grease on the substrates and follow its curing spec. press led housing to closely connect led and substrate.
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.ev erlight.com rev. 1.0 page: 12 of 12 device no. : dse-8l1-008 prepared date: nov 24, 2006 prepared by: peggy chen ehp-a08l/ut01-p01/4670 iii. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. iv. be careful because the damage of the product is often started at the time of the hand solder.

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